1-866-9-ohmite ? intl 1-847-258-0300 ? fax 1-847-574-7522 ? ww w.ohmite.com ? info@ohmite.com 177 m series heatsinks heatsink with clips for to-264 and to-247 thermal surface area weight resistance part no. (in 2 /mm 2 ) (oz./g) (c/w)* mv-102-55e 45 / 29,097 2.2 / 63 6.0 ma-102-55e 45 / 29,097 2.2 / 63 5.2 mv-101-27e 22 / 14,284 1.1 / 31 9.6 ma-101-27e 22 / 14,284 1.1 / 31 8.0 mv-302-55e 76 / 49,218 4.7 / 134 3.6 ma-302-55e 76 / 49,218 4.7 / 134 3.0 mv-301-27e 37.3 / 24,161 2.3 / 66 5.5 ma-301-27e 37.3 / 24,161 2.3 / 66 4.6 * r-theta c-a for 18w dissipation total for two devices in natural convection feature s ? minimum assembly cost and labor. spring clips make the mounting holes and fasteners obsolete in assembly operations & reduce costs. ? maximum thermal transfer. maximum surface area per unit volume, efficient cooling fins & consistent mounting force reduces thermal resistance ? maximum repeatability. constant spring force over repeated assembly/disassembly ? maximum reliability. resilient spring action locks electronic component in place. fewer parts in assembly and no fasteners and washers required. prevent short circuit by eliminating metal particles generated from hardware or thread tapping ? design flexibility. maximum flexibility for dynamic device locations and power up grading. configure- to-fit & scale-to-meet options give designers the total freedom to configure the heat sink to fit their packaging designs and to scale the heat sink to meet their power dissipations. characteristics heat sink aluminum alloy 6063-t5 or equivalent with either degreased or black anodized finish. spring clip music wire, per astm a228 with bright nickel plating solder foot cold-rolled steel, per astm a-366 with pure tin over copper strike. rohs com - pliant. interface thermal resistance thermal joint compound or 0.005 grafoil (tgon 800 by laird) interface electrical isolation sil-pad 900s by bergquist or equivalent series specific ations ohmite introduces the m series, patented (pat. no. 7,151,669), high performance, low cost, configu- rable, scalable and compact heat sink with matrix clip system for to-247 and to-264 packages. this pow- erful heat sink provides the easiest assembly, largest surface area and smallest footprint. it is the ideal type of heat sink for high power density and small size (1u or 2u) electronic packaging with forced con- vection cooling. (continued)
1-866-9-ohmite ? intl 1-847-258-0300 ? fax 1-847-574-7522 ? ww w.ohmite.com ? info@ohmite.com 178 heat di ss ipation for two devices dimensions standard part numbers part number description packaging mv-102-55e 55mm no finish (degreased) bulk ma-102-55e 55mm black anodized bulk mv-101-27e 27mm no finish (degreased) bulk ma-101-27e 27mm black anodized bulk mv-302-55e 55mm no finish (degreased) bulk ma-302-55e 55mm black anodized bulk mv-301-27e 27mm no finish (degreased) bulk ma-301-27e 27mm black anodized bulk case te mp. rise above ambient (c) heat dissipated, total for two devices (watts) 60 20 0 100 40 10 20 50 30 40 0 140 80 120 thermal resistance from case to ambient (c/watts) 1 0 2 4 800 400 0 600 1200 1000 air velocity (ft./min.) 3 5 7 6 200 ma-101-27 ma-301-27 ma-102-55 ma-302-55 w z v y 2.01" (51mm) 2.17" (55mm) 0.08" (2.0mm) x c l c l user defined values ? 0.07" (1.8mm) 4x ? 0.10" (2.5mm) w z v 0.90" (22.9mm) 1.06" (27mm) 0.08" (2.0mm) x c l user defined value ? 0.07" (1.8mm) 4x ? 0.10" (2.5mm ) -55e -27e -102-55e 0.84" (21.3mm) 1.04" .025 (26.4mm) 1.71" (43.5mm ) 0.16" (4.2mm) 2.20" (55.8mm) -302-55e -101-27e -301-27e 1.52" (38.6mm) 1.34" (34.1mm) 0.83" (21.1mm) 0.95" .025 (24.1mm) 0.14" (3.6mm) mv-102-55e series no. of clips length (mm) finish a = black anodized v = degreased rohs compliant part number w v z* mv-102-55e 1.35" / 34.3 0.95" / 24.1 0.18" / 4.6 ma-102-55e ma-101-27e ma-101-27e mv-302-55e 2.20" / 55.9 1.04" / 26.4 0.21" / 5.3 ma-302-55e ma-301-27e ma-301-27e *device package dimensions can vary. customer should verify this dimension. m series heatsinks heatsink with clips for to-264 and to-247 h ow to order
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